The TDATechnology software is a solution for finding differences in images. It compares two matching images which differences in small parts. It is mainly used for defect detection of microscopic wafer images in the semiconductor industry.

The main feature of the TDA is to compare 3D-Images. A 3D-Image consists of multiple 2D-Images. In the case of wafer images it’s a image stack of multiple focus layers. For defect detection a golden image, generated from a non-defective wafer, is used for finding differences.

The result describes the location and the size of the defect in all 3 dimensions.

The TDATechnology add-on library (DLL) guarantees easy integration in any software environment. It provides functionality for reading and writing Multiple-TIF files.

It could also be used for defect detection in non-3D images or finding the best focus layer of a image stack.

Features:

• Input:                                           Multi-Layer-Image (defect stack and reference stack), 24Bit-RGB
• Output:                                        Best-Focus layer, defect size, defect location
• Add-on library (DLL)
• Multi-TIF-Format Support:       functions for reading and writing Multi-TIF images

 TDATechnology_Back_Eng.pdf (496.11 KB)